IME
In-Mold Electronics (IME) ，IME stands for In-Mold Electronics, an integrated molding technology combining IMD (In-Mold Decoration) and flexible printed electronic circuits. It serves as the core solution for current smart surfaces and electronic skins.
On ultra-thin PET/PC films, conductive touch circuits, sensors and LED traces are printed, followed by decorative textures and light-transmissive key graphics. Micro electronic components are mounted onto the film, which is then thermoformed into a 3D curved shape. The film is placed into an injection mold, where decoration, touch control and illuminated circuits are fully encapsulated inside plastic housing in one molding step.
Simplified explanation: IMD only provides graphic decoration. IME upgrades IMD by integrating complete conductive touch circuits to realize integrated appearance & human-machine interaction.
IME Process Flow
Base Film Pretreatment
Dust removal and corona treatment on PET/PC films to boost ink adhesion as the substrate for circuit and graphic printing.
Reverse-Side Conductive Circuit Printing
Screen printing with silver/copper conductive paste to fabricate capacitive touch sensing traces, divider resistors and LED power loops, forming flexible touch film.
SMD Component Mounting
Micro LEDs, driver ICs, capacitors and resistors are mounted onto circuit traces and fixed with conductive adhesive to complete electronic function integration.
Front-Side Graphic Decoration Printing
Solid base colors, wood/metal textures, light-transmissive key symbols and light-shielding ink are printed on the opposite side of the film for cosmetic design.
3D High-Pressure Thermoforming
High-temperature vacuum forming stretches flat film into curved 3D shapes for automotive center consoles, curved home appliance panels, etc.
Trimming & Die-Cutting
Laser or mechanical die-cutting removes excess film edges to match mold cavity dimensions.
Film Loading into Injection Mold
The preformed film with embedded circuits is precisely fixed on the front mold half, with circuit layers facing the mold cavity.
High-Pressure Overmolding
Molten plastic is injected from the rear mold to fully encapsulate the circuit-bearing film. The film bonds permanently with plastic after cooling.
Mold Ejection, Trimming & Functional Testing
Integrated plastic parts are demolded, sprues are removed, and electrical tests are performed to verify touch sensitivity, backlight illumination and sensor performance for finished goods.
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